Open to analog/mixed-signal roles, 2027

Girish Arora

MSE Electrical Engineering, University of Pennsylvania (May 2027)

Analog and mixed-signal IC design, nanofabrication, power electronics

About

I am an MSE Electrical Engineering student at the University of Pennsylvania, graduating May 2027. My work sits between analog IC design and the fab. I design circuits in Cadence (a 45 nm TIA, an SRAM array) and I also grow and characterize the films those circuits depend on. At Penn's Quattrone Nanofabrication Facility I am developing an ALD process for aluminum-doped zinc oxide as a replacement for ITO. Before Penn I did a B.E. in Electronics and Communication at Thapar in India and spent a summer building motor driver hardware and firmware for warehouse robots.

Long term, I want to work on analog and mixed-signal silicon in the US and then build a semiconductor manufacturing business in India.

Education

  • University of Pennsylvania, School of Engineering and Applied ScienceAug 2025 to May 2027

    Master of Science in Engineering, Electrical Engineering

  • Thapar Institute of Engineering and TechnologySep 2021 to Jun 2025

    Bachelor of Engineering, Electronics and Communication. GPA 3.89/4.0.

    Merit-III Scholarship, 2nd and 3rd year, top 10% of class.

Girish in a full cleanroom gown, hood, and safety glasses

Experience

Quattrone Nanofabrication Facility (QNF), Penn

Graduate Student Fellow

Sep 2026 to present

I am developing an atomic layer deposition (ALD) process for aluminum-doped zinc oxide (AZO) as a replacement for ITO. I grow ZnO:Al films on a Cambridge S200 ALD tool, fit each film's optical response with spectroscopic ellipsometry in WVASE, and use XRD and my own Python analysis to tie doping level to film properties.

  • 200 °C doping series from DEZ, TMA, and H2O at 99:1, 49:1, and 19:1 ZnO:Al cycle ratios.
  • Ellipsometry fits give 85 to 88 nm film thickness at fit MSE below 7.
  • 0.2 eV Burstein-Moss band-edge shift (3.35 to 3.58 eV) and free-carrier absorption at 19:1, consistent with literature.
AZO films on the ellipsometer stage

p-Chip Corporation, Philadelphia

Hardware Development Intern

Jun 2026 to Aug 2026

I worked on the transmitter side of a laser reader for RF microtransponders. I designed and tested a scanning-mirror drive subsystem that extended the reader's working distance, and validated it on the bench with photodiode timing measurements.

Addverb Technologies, India

Embedded Systems Intern

Jan 2025 to Jul 2025

I built motor-drive hardware and firmware for Zippy warehouse robots. I designed a BLDC motor driver board, wrote STM32 firmware for its current-sense amplifier with moving-average filtering, and integrated an R320M Wi-Fi 6 SOM as a TCP server on the robots.

Detkin Lab, Penn ESE

ESE Lab Leader

Jan 2026 to present

I help students in Penn's embedded and circuit labs with instruments and components, and troubleshoot measurement, equipment, and circuit problems. I also run lab procurement: I maintain the inventory tracker and source parts from DigiKey, McMaster-Carr, and Amazon.

Projects

Analog IC designAug 2025 to Dec 2025

Wideband Transimpedance Amplifier in 45 nm CMOS

  • 1 V CMOS TIA for photodiode front ends.
  • 109 dBΩ transimpedance gain, ~492 MHz bandwidth, ~4.5e-14 A²/Hz input-referred noise, 2.76 mW power.

Tools: Cadence Virtuoso, Spectre.

Analog/mixed-signal IC design2024

Phase-Locked Loop for SerDes Clock Generation in 180 nm CMOS

  • Charge-pump PLL for SerDes clocking: phase-frequency detector, charge pump with loop filter, 3-stage ring VCO, and frequency divider.
  • 4.44 GHz output at 1.8 V supply with 50% duty cycle, from transient simulation (typical corner, 25 °C).

Undergraduate capstone, team of four. Tools: Cadence Virtuoso, Spectre. GitHub repo →

Memory circuit designSep 2025 to Dec 2025

16×4 SRAM Memory Circuit

  • Read access delay 3.348 ps.
  • Cut power from 131 µW at 1.2 V to 33 µW at 1.0 V through supply-voltage scaling.
SOI die mounted in the center of a gold-plated carrier board, held in a gloved hand under cleanroom yellow light
SOI die on a carrier board, ESE 5360.

NanofabricationJan 2026 to May 2026

Cleanroom Device Fabrication (ESE 5360)

  • 60 hours of hands-on cleanroom work: photolithography, EBL, RIE/DRIE plasma etch, PECVD and sputtered thin films, ALD, wet processing, device release.
  • Fabricated MEMS actuators on SOI. Verified the 2.6 µm device layer by reflectometry.
  • Patterned PS-b-PMMA by directed self-assembly with 23 nm feature heights.
  • Also worked on graphene transistors and CdSe quantum dot synthesis.

Power electronicsSep 2026 to present

Power Device Characterization (ESE 5800)

  • Characterized an STPS360AF Schottky diode and an IRLML0040 MOSFET from 0.02 to 4 A with pulsed bench measurements.
  • Automated the measurements in Python/PyVISA on Keysight E36441A and 34461A instruments.
  • Fit simplified models (VFWD = 0.330 V, RON = 66.5 mΩ, RDS(on) = 65.1 mΩ) and validated them against vendor SPICE models and datasheet curves.
Girish standing next to the Robust Compute-in-Memory for Edge Healthcare poster
Presenting the compute-in-memory poster, ESE 5760.

Semiconductor memoryJan 2026 to May 2026

Robust Compute-in-Memory for Edge Healthcare (ESE 5760)

  • Modeled OxRAM and PCM 2T2R crossbar non-idealities (RTN, conductance drift) inside hardware-aware training of a 1D-CNN ECG classifier.
  • PCM showed 11% lower energy-delay product (0.0275 µJ per inference).

Edge AI hardware2025

NeuroSense

  • Real-time mental health monitor that runs entirely on the device. It combines facial emotion recognition, speech cues, and EEG to detect stress, anxiety, and other emotional states.
  • Hardware: STM32N6570-DK with its built-in NPU, an EEG front end with instrumentation amplifier and filtering, a YOLOv8-based emotion model, and a TouchGFX touchscreen UI.
  • Global 3rd place, Elektor-STM32 Edge-AI Competition 2025. 423+ entries from 31+ countries. €1,000 prize. Team of three.

Wearable2025

NeuroBand

  • Safety armband for elderly and high-risk users. It detects falls and tracks heart rate and ECG. On a fall it sounds an SOS alarm and sends a Wi-Fi alert to a caregiver app with the ECG recorded just before the event.
  • Hardware: ESP32-S3 running an on-device fall classifier on accelerometer and gyroscope data, plus heart-rate and ECG sensors.
  • Top 10 of 2,959, Circuit Digest Smart Home and Wearables Project Contest 2025.

Digital design / FPGA2024

FPGA Flight Controller for a Quadcopter

  • Quadcopter flight controller written in HDL on a Basys-3 (Artix-7) FPGA instead of a microcontroller.
  • Modules: PWM decoders for throttle, yaw, pitch, and roll from the RC receiver, an I2C master for the MPU-6050 IMU, a PID controller, and a PWM encoder driving the ESCs.
  • My part: interfacing the peripherals with the FPGA, the FPV camera, and the PWM encoder and decoder HDL. All four motors synchronized with the transmitter and receiver.

Team project, Thapar. Tools: Xilinx Vivado. GitHub repo →

Skills

Fab and process
  • Photolithography
  • EBL (Raith EBPG)
  • ALD
  • sputtering (PVD)
  • PECVD
  • RIE/DRIE
  • wet processing
  • device release
Metrology and characterization
  • SEM
  • AFM
  • spectroscopic ellipsometry (WVASE)
  • XRD
  • reflectometry
  • profilometry
  • white-light interferometry
  • pulsed I-V (PyVISA)
Design and simulation
  • Cadence Virtuoso
  • Spectre
  • LTspice
  • NVSim
  • NeuroSim
  • Tanner
  • Xilinx Vivado
  • Mentor PADS
  • KiCad
Test and debug
  • Oscilloscope (differential and current probes)
  • logic analyzer
  • spectrum analyzer
  • signal generator
  • DMM
  • LCR meter
Programming
  • Python (data analysis, PyVISA instrument automation, PyTorch)
  • MATLAB
  • C
  • Verilog